master thesis wafer bonding and system packaging
Fraunhofer ENAS is one of the world's leading institutes in the field of heterogeneous integration (MEMS, CMOS) at the wafer and chip level. The wafer-level MEMS package must allow access to the desired media to be measured (e.g., liquids, gases or light), but at the same time shield unwanted external influences. These connection technologies are not only applied to passive elements but are also used for active elements such as micromirrors and print heads. Electronic components must also be included in the microsystem to further advance system integration. In addition to hybrid integration at chip-level, the System Packaging department is carrying out investigations into integration at the wafer level. In such a vertical stack, particular attention must be paid to the influences of the individual connection technologies (temperature, pressure) as well as the electrical and thermal behavior of the system. A complete clean room preparation line including metallization, characterization equipment for processing 4" to 8" substrates is available for permanent and temporary bonding at the wafer level. We are therefore looking for dedicated Master's students to join our multidisciplinary team and contribute to cutting-edge research in the field of wafer bonding and system packaging.
What you will do
anodic and hybrid bonding. You will develop an in-depth understanding of the topic.
What you bring to the table
materials science or a similar field of study.
wafer bonding or packaging technologies.
but this is not a mandatory requirement.
What you can expect
We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Interested? Apply online now. We look forward to getting to know you!
Fraunhofer Institute for Electronic Nano Systems ENAS
Requisition Number: 71536 Application Deadline: from now
Job Segment:
Materials Science, Research Scientist, Mechanical Engineer, Electrical Engineering, Science, Engineering, Research