City:  Cottbus
Date:  Mar 26, 2024

Bachelor/Master thesis - High-Frequency Design

The Fraunhofer-Gesellschaft ( currently operates 76 institutes and research institutions throughout Germany and is the world’s leading applied research organization. Around 30 800 employees work with an annual research budget of 3.0 billion euros. 

The Fraunhofer Institute for Reliability and Microintegration, IZM, is one of the world's leading institutes for electronic packaging and system-integration technologies as well as for applied research and development of robust and reliable electronic components, modules and systems.


R&D activities at Fraunhofer IZM in Cottbus concentrate on the design and development of application-specific high-frequency radar sensor modules, 5G and 6G antenna-in-package (AiP) front-end modules as well as RF packaging structures, interposers and system-boards, especially for sensing, communication, computing and security applications.


To support this team, we are looking for a Bachelor's or Master's student in the field of high-frequency design.


What you will do

  • Literature review on state of the art in high-frequency design of selected structures in electronic packaging (e.g. transmission lines, vias, solder balls) for high performance computing (HPC), radar sensing or wireless communication (e.g. 6G) applications
  • Electromagnetic modeling, simulation and layout of selected electronic packaging structures
  • High-frequency measurement of packaging structures and documentation of results


What you bring to the table

  • You are studying electrical engineering, physics or a comparable subject
  • Interest in high frequency/microwave engineering
  • Willingness to learn, flexibility and a solution-orientated way of working
  • Independent and structured working method
  • Ability to work in a team and strong communication skills
  • Good knowledge of German and/or English language
  • Flexible design options to suit the study plan


What you can expect

  • Introduction to electromagnetic modeling, simulation, layout and measurement of electronic packaging structures
  • Very good supervision of your thesis
  • Open and collegial working environment
  • State-of-the-art laboratory equipment and software tools for high-frequency design, test and characterization up to 500 GHz
  • Opportunity to participate in cutting-edge research and development projects with national and international partners


This position is initially limited to six months, but we are interested in long-term employment. The working hours are 40-80 hours per month. We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. 32884

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future. 

Interested? Apply online now. We look forward to getting to know you!


Fraunhofer Institute for Reliability and Microintegration IZM


Requisition Number: 72146                


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