Thesis »Development of a tacking agent for sintering applications in microelectronic packaging«
In response to increasing reliability requirements in power electronics and the cost advantage over silver sintering, copper sintering is increasingly becoming the focus of research in microelectronic packaging technology. One challenge, however, is the lack of tacking in dried copper pastes and preforms after the chips have been placed. Especially in series production, the placed chips can shift and thus negatively affect the sintering quality. The aim of this work is therefore to develop a tacking agent that is compatible with the sintering process, fixes the chips and, if necessary, has a reducing effect on the copper surface.
What you will do
What you bring to the table
What you can expect
We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Remuneration according to the general works agreement for employing assistant staff.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
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If you have any questions about this position, please contact us at Ivi.bewerbung.studenten@ivi.fraunhofer.de
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Fraunhofer Institute for Transportation and Infrastructure Systems IVI
Requisition Number: IVI-SHK-00755
Job Segment:
Materials Science, Application Developer, Developer, Science, Technology, Bilingual, Research