Students in the field of CMUT design, development and application-oriented characterization
The Microacoustic Systems (MAS) Group in System Packaging (SP) department specializes in the development and fabrication of Capacitive Micromachined Ultrasound Transducers (CMUTs) building on SP’s well established wafer bonding technology. CMUTs are emerging as excellent alternatives to conventional ultrasound transducers because of their numerous advantages like miniaturization, wide bandwidth, design flexibility, high temperature stability, batch production and high sensitivity. Having demonstrated several use cases of CMUTs in the past, the MAS group is actively researching innovative CMUT designs for future applications.
We are currently seeking candidates for research projects / theses and student assistant positions. We can discuss our ideas together to find the right job for you.
What you will do
What you bring to the table
What you can expect
We value and promote the diversity of our employees' skills and therefore welcome all applications - regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability.
With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.
Interested? Apply online now. Please attach your certificates and a current overview of your grades to your application.
We look forward to getting to know you!
Please address any questions you may have to
Michaela Baum
E-mail: recruiting@enas.fraunhofer.de
For data protection reasons, we can only consider applications via our career portal - thank you.
Fraunhofer Institute for Electronic Nano Systems ENAS
Requisition Number: 80645 Application Deadline: 10/31/2025
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